Хонинговальные головки

Accessories used in lapping are dressing rings and workpiece receivers, as well as devices used to weigh down or remove weight from the workpieces and supply equipment for providing lapping slurry. The dressing rings located on the machin­ing disc are supported by lateral guide arms with rollers and receive rotary motion through friction locking when […]

The production of silicon discs, so-called wafers, with the highest quality stan­dards is an essential part in the manufacturing chain of semiconductor devices. Proceeding from up to two metre long ingots, the semi-finished monocrystalline silicon product, individual wafers with a thickness of less than a millimetre are separated in a cutting operation. For example, the […]

The primary variable of this variant is normal force with which the workpiece is pressed against the grinding belt. The depth of cut is a result of the amount of pressure force, the abrasive belt’s topography, the component material and other process variables like the cutting and workpiece speeds. The pressure force is related to […]

The wear processes on the abrasive grain and the bond described in chapter 2.4 lead to changes to the tool topography during the grinding process. At the beginning of the process, a rough grinding wheel surface with a multi­tude of sharp grain cutting edges at varying cutting edge depths can be observed. In the course […]

The work result, especially workpiece roughness, is dependent in particular on the machining time. The roughness, resulting from pre-machining has to be improved by the honing process and leads to a typical temporal course (Fig. 7-18). Initially the peaks of roughness are removed quickly. After a relatively short machining time, the surface roughness asymptotically approaches […]

As discussed above, the lapping process is influenced by numerous technologi­cally-based marginal conditions. An overview of these is given in Fig. 8-10. Kinematics Lapping plate Slurry Machine Workpieces • Rotational • Material • Grain material • Normal force • Material speeds • Slot configu- • Grain size • Machine • Geometry • Dimensions ration and […]

In the case of cutting wire grinding, wires with bonded abrasive material, usually diamond, are used (Fig. 9-10). Galvanic or synthetic resin-bonds have so far gen­erally been used for the bond system. By using bonded grains, we can do away with an additional lapping suspension. In this process, material removal is very similar to that […]

This is a little used procedure in belt processes in comparison to grinding with constant pressure force. Growing quality demands on components however are leading to wider use of methods with constant depth of cut. For example, it is used for a perfectly meas­ured and fitting manufacture of functional and sealing surfaces. Further areas of […]

High material removal rates and the highest surface quality are mutually exclu­sive. For this reason, shortening the machining time by increasing the material re­moval rate is faced with severe limitations when the material removal rate is con­stant during the process. In this case one speaks of a single-staged process. In roughing (Fig. 6-124), the volume […]

Corresponding to a multifaceted spectrum of parts, a broad range of different tools is used in honing, particularly in longitudinal stroke honing of holes. The differ­ences are a result on the one hand of a range of diameter of approximately 2 to 1500 mm. The amount of space available in a given hole and different […]